Yuxuan Huang, Zhihua Tao, Xudong Cai, Zhiyuan Long, Zewei Lin, Wenlei Li, Zhen Fang, Lingyue Wang, Siqi He, Xingzhou Cai, Yong Li, Jihua Zhang. Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer. Microelectronics Journal, 152:106371, 2024. [doi]
@article{HuangTCLLLFWHCLZ24,
title = {Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer},
author = {Yuxuan Huang and Zhihua Tao and Xudong Cai and Zhiyuan Long and Zewei Lin and Wenlei Li and Zhen Fang and Lingyue Wang and Siqi He and Xingzhou Cai and Yong Li and Jihua Zhang},
year = {2024},
doi = {10.1016/j.mejo.2024.106371},
url = {https://doi.org/10.1016/j.mejo.2024.106371},
researchr = {https://researchr.org/publication/HuangTCLLLFWHCLZ24},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {152},
pages = {106371},
}