Yuxuan Huang, Zhihua Tao, Xudong Cai, Zhiyuan Long, Zewei Lin, Wenlei Li, Zhen Fang, Lingyue Wang, Siqi He, Xingzhou Cai, Yong Li, Jihua Zhang. Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer. Microelectronics Journal, 152:106371, 2024. [doi]
Abstract is missing.