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Improving the FE simulation of molded packages using warpage measurements

Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang. Improving the FE simulation of molded packages using warpage measurements. Microelectronics Reliability, 54(9-10):1862-1866, 2014. [doi]

Authors

Saskia Huber

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Marius van Dijk

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Hans Walter

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Olaf Wittler

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Tina Thomas

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Klaus-Dieter Lang

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