Improving the FE simulation of molded packages using warpage measurements

Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang. Improving the FE simulation of molded packages using warpage measurements. Microelectronics Reliability, 54(9-10):1862-1866, 2014. [doi]

Abstract

Abstract is missing.