Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang. Improving the FE simulation of molded packages using warpage measurements. Microelectronics Reliability, 54(9-10):1862-1866, 2014. [doi]
@article{HuberDWWTL14,
title = {Improving the FE simulation of molded packages using warpage measurements},
author = {Saskia Huber and Marius van Dijk and Hans Walter and Olaf Wittler and Tina Thomas and Klaus-Dieter Lang},
year = {2014},
doi = {10.1016/j.microrel.2014.07.156},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.156},
researchr = {https://researchr.org/publication/HuberDWWTL14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1862-1866},
}