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3D resistive RAM cell design for high-density storage class memory - a review

Boris Hudec, Chung-Wei Hsu, I-Ting Wang, Wei-Li Lai, Che-Chia Chang, Taifang Wang, Karol Fröhlich, Chia-Hua Ho, Chen-Hsi Lin, Tuo-Hung Hou. 3D resistive RAM cell design for high-density storage class memory - a review. Science in China Series F: Information Sciences, 59(6), 2016. [doi]

Authors

Boris Hudec

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Chung-Wei Hsu

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I-Ting Wang

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Wei-Li Lai

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Che-Chia Chang

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Taifang Wang

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Karol Fröhlich

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Chia-Hua Ho

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Chen-Hsi Lin

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Tuo-Hung Hou

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