Boris Hudec, Chung-Wei Hsu, I-Ting Wang, Wei-Li Lai, Che-Chia Chang, Taifang Wang, Karol Fröhlich, Chia-Hua Ho, Chen-Hsi Lin, Tuo-Hung Hou. 3D resistive RAM cell design for high-density storage class memory - a review. Science in China Series F: Information Sciences, 59(6), 2016. [doi]
Abstract is missing.