Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors

James N. Humenik, James M. Oberschmidt, Leon L. Wu, Scott G. Paull. Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors. IBM Journal of Research and Development, 36(5):935-942, 1992.

Abstract

Abstract is missing.