Wei-Lun Hung, Greg M. Link, Yuan Xie, Narayanan Vijaykrishnan, Mary Jane Irwin. Interconnect and Thermal-aware Floorplanning for 3D Microprocessors. In 7th International Symposium on Quality of Electronic Design (ISQED 2006), 27-29 March 2006, San Jose, CA, USA. pages 98-104, IEEE Computer Society, 2006. [doi]
Abstract is missing.