Xiao Huo, Guo-Wei Xiao, Kevin J. Chen, Philip C. H. Chan. Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 537-540, IEEE, 2003. [doi]
@inproceedings{HuoXCC03,
title = {Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology},
author = {Xiao Huo and Guo-Wei Xiao and Kevin J. Chen and Philip C. H. Chan},
year = {2003},
doi = {10.1109/CICC.2003.1249455},
url = {https://doi.org/10.1109/CICC.2003.1249455},
researchr = {https://researchr.org/publication/HuoXCC03},
cites = {0},
citedby = {0},
pages = {537-540},
booktitle = {Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003},
publisher = {IEEE},
isbn = {0-7803-7842-3},
}