Xiao Huo, Guo-Wei Xiao, Kevin J. Chen, Philip C. H. Chan. Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology. In Proceedings of the IEEE Custom Integrated Circuits Conference, CICC 2003, San Jose, CA, USA, September 21 - 24, 2003. pages 537-540, IEEE, 2003. [doi]
Abstract is missing.