Fumiya Iida, Liyu Wang, Luzius Brodbeck, Derek Leach, Surya G. Nurzaman, Utku Culha. The Solving by Building Approach Based on Thermoplastic Adhesives. In Masayuki Inaba, Peter Corke, editors, Robotics Research - The 16th International Symposium ISRR, 16-19 December 2013, Singapore. Volume 114 of Springer Tracts in Advanced Robotics, pages 221-236, Springer, 2013. [doi]
@inproceedings{IidaWBLNC13,
title = {The Solving by Building Approach Based on Thermoplastic Adhesives},
author = {Fumiya Iida and Liyu Wang and Luzius Brodbeck and Derek Leach and Surya G. Nurzaman and Utku Culha},
year = {2013},
doi = {10.1007/978-3-319-28872-7_13},
url = {http://dx.doi.org/10.1007/978-3-319-28872-7_13},
researchr = {https://researchr.org/publication/IidaWBLNC13},
cites = {0},
citedby = {0},
pages = {221-236},
booktitle = {Robotics Research - The 16th International Symposium ISRR, 16-19 December 2013, Singapore},
editor = {Masayuki Inaba and Peter Corke},
volume = {114},
series = {Springer Tracts in Advanced Robotics},
publisher = {Springer},
isbn = {978-3-319-28870-3},
}