An image sensor/processor 3D stacked module featuring ThruChip interfaces - researchr publication authors

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Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura. An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 7-8, IEEE, 2017. [doi]

This author has not been identified. Look up 'Masayuki Ikebe' in GoogleThis author has not been identified. Look up 'Tetsuya Asai' in GoogleThis author has not been identified. Look up 'Masafumi Mori' in GoogleThis author has not been identified. Look up 'Toshiyuki Itou' in GoogleThis author has not been identified. Look up 'Daisuke Uchida' in GoogleThis author has not been identified. Look up 'Yasuhiro Take' in GoogleThis author has not been identified. Look up 'Tadahiro Kuroda' in GoogleThis author has not been identified. Look up 'Masato Motomura' in Google

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