Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura. An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017. pages 7-8, IEEE, 2017. [doi]
@inproceedings{IkebeAMIUTKM17,
title = {An image sensor/processor 3D stacked module featuring ThruChip interfaces},
author = {Masayuki Ikebe and Tetsuya Asai and Masafumi Mori and Toshiyuki Itou and Daisuke Uchida and Yasuhiro Take and Tadahiro Kuroda and Masato Motomura},
year = {2017},
doi = {10.1109/ASPDAC.2017.7858275},
url = {http://dx.doi.org/10.1109/ASPDAC.2017.7858275},
researchr = {https://researchr.org/publication/IkebeAMIUTKM17},
cites = {0},
citedby = {0},
pages = {7-8},
booktitle = {22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, January 16-19, 2017},
publisher = {IEEE},
isbn = {978-1-5090-1558-0},
}