Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo. DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip. In 2022 IEEE Hot Chips 34 Symposium, HCS 2022, Cupertino, CA, USA, August 21-23, 2022. pages 1-25, IEEE, 2022. [doi]
Abstract is missing.