Michihiro Inoue, Fumito Imura, Arami Saruwatari, Shiro Hara. Packaging in minimal fab: An integrated semiconductor line from wafer process to packaging process. In International Conference on IC Design and Technology, ICICDT 2016, Ho Chi Minh, Vietnam, June 27-29, 2016. pages 1-3, IEEE, 2016. [doi]
Abstract is missing.