Hierarchical 3D interconnection architecture with tightly-coupled processor-memory integration

Kiyoto Ito, Makoto Saen, Kenichi Osada, Tomoyuki Kodama, Hiroyuki Mizuno. Hierarchical 3D interconnection architecture with tightly-coupled processor-memory integration. In IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010. pages 1-6, IEEE, 2010. [doi]

@inproceedings{ItoSOKM10,
  title = {Hierarchical 3D interconnection architecture with tightly-coupled processor-memory integration},
  author = {Kiyoto Ito and Makoto Saen and Kenichi Osada and Tomoyuki Kodama and Hiroyuki Mizuno},
  year = {2010},
  doi = {10.1109/3DIC.2010.5751440},
  url = {http://dx.doi.org/10.1109/3DIC.2010.5751440},
  tags = {architecture},
  researchr = {https://researchr.org/publication/ItoSOKM10},
  cites = {0},
  citedby = {0},
  pages = {1-6},
  booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2010, Munich, Germany, 16-18 November 2010},
  publisher = {IEEE},
}