A Methodology for Early Exploration of TSV Placement Topologies in 3D Stacked ICs

Radhika Jagtap, Sumeet S. Kumar, Rene van Leuken. A Methodology for Early Exploration of TSV Placement Topologies in 3D Stacked ICs. In 15th Euromicro Conference on Digital System Design, DSD 2012, Cesme, Izmir, Turkey, September 5-8, 2012. pages 382-388, IEEE, 2012. [doi]

Abstract

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