Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors

Grzegorz Janczyk, Tomasz Bieniek, J. Szynka, P. Grabiec. Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]

Abstract

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