Kyung Woon Jang, Jin Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik. A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. Microelectronics Reliability, 52(6):1174-1181, 2012. [doi]
@article{JangPLP12, title = {A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages}, author = {Kyung Woon Jang and Jin Hyoung Park and Soon-Bok Lee and Kyung-Wook Paik}, year = {2012}, doi = {10.1016/j.microrel.2011.12.022}, url = {http://dx.doi.org/10.1016/j.microrel.2011.12.022}, researchr = {https://researchr.org/publication/JangPLP12}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {52}, number = {6}, pages = {1174-1181}, }