A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Kyung Woon Jang, Jin Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik. A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. Microelectronics Reliability, 52(6):1174-1181, 2012. [doi]

Abstract

Abstract is missing.