The following publications are possibly variants of this publication:
- Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applicationsKyung Woon Jang, Chang-Kyu Chung, Woong-Sun Lee, Kyung-Wook Paik. mr, 48(7):1052-1061, 2008. [doi]
- Effect of glue on reliability of flip chip BGA packages under thermal cyclingTung T. Nguyen, Donggun Lee, Jae B. Kwak, SeungBae Park. mr, 50(7):1000-1006, 2010. [doi]
- Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate applicationJ. S. Hwang, M. J. Yim, K. W. Paik. mr, 48(2):293-299, 2008. [doi]
- Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental studyWoon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik. mr, 46(2-4):589-599, 2006. [doi]