Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné. BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. In 23rd IEEE European Test Symposium, ETS 2018, Bremen, Germany, May 28 - June 1, 2018. pages 1-6, IEEE, 2018. [doi]
@inproceedings{JaniLVAB18,
title = {BISTs for post-bond test and electrical analysis of high density 3D interconnect defects},
author = {Imed Jani and Didier Lattard and Pascal Vivet and Lucile Arnaud and Edith Beigné},
year = {2018},
doi = {10.1109/ETS.2018.8400698},
url = {https://doi.org/10.1109/ETS.2018.8400698},
researchr = {https://researchr.org/publication/JaniLVAB18},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {23rd IEEE European Test Symposium, ETS 2018, Bremen, Germany, May 28 - June 1, 2018},
publisher = {IEEE},
isbn = {978-1-5386-3728-9},
}