Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné. BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. In 23rd IEEE European Test Symposium, ETS 2018, Bremen, Germany, May 28 - June 1, 2018. pages 1-6, IEEE, 2018. [doi]
Abstract is missing.