Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sebastien Thuries, Edith Beigné. Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. In 24th IEEE European Test Symposium, ETS 2019, Baden-Baden, Germany, May 27-31, 2019. pages 1-2, IEEE, 2019. [doi]
@inproceedings{JaniLVDTB19,
title = {Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning},
author = {Imed Jani and Didier Lattard and Pascal Vivet and Jean Durupt and Sebastien Thuries and Edith Beigné},
year = {2019},
doi = {10.1109/ETS.2019.8791531},
url = {https://doi.org/10.1109/ETS.2019.8791531},
researchr = {https://researchr.org/publication/JaniLVDTB19},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {24th IEEE European Test Symposium, ETS 2019, Baden-Baden, Germany, May 27-31, 2019},
publisher = {IEEE},
isbn = {978-1-7281-1173-5},
}