Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sebastien Thuries, Edith Beigné. Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. In 24th IEEE European Test Symposium, ETS 2019, Baden-Baden, Germany, May 27-31, 2019. pages 1-2, IEEE, 2019. [doi]
Abstract is missing.