Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu 0010, Ming Liu 0022, Ningsheng Xu. 14.1 THz-TSI: A 0.33pJ/b 264Gb/s Through-Silicon Interconnect Module for 3D Integration Utilizing Terahertz Coupling. In IEEE International Solid-State Circuits Conference, ISSCC 2026, San Francisco, CA, USA, February 15-19, 2026. pages 1-3, IEEE, 2026. [doi]
Abstract is missing.