Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis. Cost Modeling and Analysis of TSV and Contactless 3D-ICs. In Tinoosh Mohsenin, Weisheng Zhao, Yiran Chen, Onur Mutlu, editors, GLSVLSI '20: Great Lakes Symposium on VLSI 2020, Virtual Event, China, September 7-9, 2020. pages 519-524, ACM, 2020. [doi]
Abstract is missing.