Park Jong-Kyung, Park Sang-Woo, Jeong Min-Seong. Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding. In 20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023. pages 223-224, IEEE, 2023. [doi]
@inproceedings{JongKyungSM23,
title = {Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding},
author = {Park Jong-Kyung and Park Sang-Woo and Jeong Min-Seong},
year = {2023},
doi = {10.1109/ISOCC59558.2023.10396380},
url = {https://doi.org/10.1109/ISOCC59558.2023.10396380},
researchr = {https://researchr.org/publication/JongKyungSM23},
cites = {0},
citedby = {0},
pages = {223-224},
booktitle = {20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023},
publisher = {IEEE},
isbn = {979-8-3503-2703-8},
}