Park Jong-Kyung, Park Sang-Woo, Jeong Min-Seong. Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding. In 20th International SoC Design Conference, ISOCC 2023, Jeju, Republic of Korea, October 25-28, 2023. pages 223-224, IEEE, 2023. [doi]
Abstract is missing.