Capacitance of TSVs in 3-D stacked chips a problem?: not for neuromorphic systems!

Antoine Joubert, Marc Duranton, Bilel Belhadj, Olivier Temam, Rodolphe Héliot. Capacitance of TSVs in 3-D stacked chips a problem?: not for neuromorphic systems!. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 1264-1265, ACM, 2012. [doi]

Abstract

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