Material improvement for ultrathin-wafer handling in TSV creation and PECVD process - researchr publication authors

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Amadine Jouve, Wenbin Hong, D. Blumenshine, JoElle Dachsteiner, Rama Puligadda, Dongshun Bai, J. Diaz, David Henry. Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]

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