Amadine Jouve, Wenbin Hong, D. Blumenshine, JoElle Dachsteiner, Rama Puligadda, Dongshun Bai, J. Diaz, David Henry. Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-5, IEEE, 2009. [doi]
@inproceedings{JouveHBDPBDH09,
title = {Material improvement for ultrathin-wafer handling in TSV creation and PECVD process},
author = {Amadine Jouve and Wenbin Hong and D. Blumenshine and JoElle Dachsteiner and Rama Puligadda and Dongshun Bai and J. Diaz and David Henry},
year = {2009},
doi = {10.1109/3DIC.2009.5306523},
url = {http://dx.doi.org/10.1109/3DIC.2009.5306523},
researchr = {https://researchr.org/publication/JouveHBDPBDH09},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009},
publisher = {IEEE},
}