Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Amadine Jouve, L. Sanchez, C. Castan, N. Bresson, F. Fournel, N. Raynaud, P. Metzger. Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-7, IEEE, 2019. [doi]

This author has not been identified. Look up 'Amadine Jouve' in GoogleThis author has not been identified. Look up 'L. Sanchez' in GoogleThis author has not been identified. Look up 'C. Castan' in GoogleThis author has not been identified. Look up 'N. Bresson' in GoogleThis author has not been identified. Look up 'F. Fournel' in GoogleThis author has not been identified. Look up 'N. Raynaud' in GoogleThis author has not been identified. Look up 'P. Metzger' in Google

runs on WebDSL