Amadine Jouve, L. Sanchez, C. Castan, N. Bresson, F. Fournel, N. Raynaud, P. Metzger. Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-7, IEEE, 2019. [doi]
Abstract is missing.