Moongon Jung, David Z. Pan, Sung Kyu Lim. Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. In Patrick Groeneveld, Donatella Sciuto, Soha Hassoun, editors, The 49th Annual Design Automation Conference 2012, DAC '12, San Francisco, CA, USA, June 3-7, 2012. pages 317-326, ACM, 2012. [doi]
Abstract is missing.