Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis - researchr publication authors

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Cheong-Ha Jung, Won Seo, Gu-sung Kim. Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-2, IEEE, 2019. [doi]

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