Cheong-Ha Jung, Won Seo, Gu-sung Kim. Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-2, IEEE, 2019. [doi]
@inproceedings{JungSK19-2,
title = {Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis},
author = {Cheong-Ha Jung and Won Seo and Gu-sung Kim},
year = {2019},
doi = {10.1109/3DIC48104.2019.9058848},
url = {https://doi.org/10.1109/3DIC48104.2019.9058848},
researchr = {https://researchr.org/publication/JungSK19-2},
cites = {0},
citedby = {0},
pages = {1-2},
booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019},
publisher = {IEEE},
isbn = {978-1-7281-4870-0},
}