Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design

M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng. Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design. In IEEE/ACM International Conference On Computer Aided Design, ICCAD 2020, San Diego, CA, USA, November 2-5, 2020. pages 1-8, IEEE, 2020. [doi]

Abstract

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