Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density

Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma. Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectronics Reliability, 55(12):2554-2559, 2015. [doi]

Authors

Takuya Kadoguchi

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Keisuke Gotou

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Kimihiro Yamanaka

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Shijo Nagao

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Katsuaki Suganuma

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