Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma. Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectronics Reliability, 55(12):2554-2559, 2015. [doi]
Abstract is missing.