Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma. Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density. Microelectronics Reliability, 55(12):2554-2559, 2015. [doi]
@article{KadoguchiGYNS15,
title = {Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density},
author = {Takuya Kadoguchi and Keisuke Gotou and Kimihiro Yamanaka and Shijo Nagao and Katsuaki Suganuma},
year = {2015},
doi = {10.1016/j.microrel.2015.10.003},
url = {http://dx.doi.org/10.1016/j.microrel.2015.10.003},
researchr = {https://researchr.org/publication/KadoguchiGYNS15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {12},
pages = {2554-2559},
}