Andrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi, Bangqi Xu. Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2019, Florence, Italy, March 25-29, 2019. pages 842-847, IEEE, 2019. [doi]
Abstract is missing.