3D integration technology for 3D stacked retinal chip

Yoshiyuki Kaiho, Yuki Ohara, Hirotaka Takeshita, Kouji Kiyoyama, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi. 3D integration technology for 3D stacked retinal chip. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-4, IEEE, 2009. [doi]

Abstract

Abstract is missing.