Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array

Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee. Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array. IEEE Design & Test of Computers, 23(3):212-219, 2006. [doi]

Abstract

Abstract is missing.