Nabeeh Kandalaft, Rashid Rashidzadeh, Majid Ahmadi. Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(4):538-546, 2013. [doi]
@article{KandalaftRA13,
title = {Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing},
author = {Nabeeh Kandalaft and Rashid Rashidzadeh and Majid Ahmadi},
year = {2013},
doi = {10.1109/TCAD.2012.2237226},
url = {http://dx.doi.org/10.1109/TCAD.2012.2237226},
researchr = {https://researchr.org/publication/KandalaftRA13},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {32},
number = {4},
pages = {538-546},
}