Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing

Nabeeh Kandalaft, Rashid Rashidzadeh, Majid Ahmadi. Testing 3-D IC Through-Silicon-Vias (TSVs) by Direct Probing. IEEE Trans. on CAD of Integrated Circuits and Systems, 32(4):538-546, 2013. [doi]

Abstract

Abstract is missing.