Fault Modeling and Multi-Tone Dither Scheme for Testing 3D TSV Defects

Sukeshwar Kannan, Bruce C. Kim, Byoungchul Ahn. Fault Modeling and Multi-Tone Dither Scheme for Testing 3D TSV Defects. J. Electronic Testing, 28(1):39-51, 2012. [doi]

Abstract

Abstract is missing.