Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance - researchr publication authors

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Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir. Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]

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