Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh. Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
@inproceedings{KhurramPBSS16,
title = {Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC},
author = {Kumail Khurram and Asisa Kumar Panigrahi and Satish Bonam and Om Krishan Singh and Shiv Govind Singh},
year = {2016},
doi = {10.1109/3DIC.2016.7970005},
url = {https://doi.org/10.1109/3DIC.2016.7970005},
researchr = {https://researchr.org/publication/KhurramPBSS16},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}